Press Release: Bills Signed: H.R. 4346
On Tuesday, August 9, 2022, the President signed into law:
H.R. 4346, which appropriates a total of $54.2 billion to support domestic semiconductor manufacturing, research and development, semiconductor workforce development, international information and communications technology security and semiconductor supply chain activities, and advanced wireless communication technologies; establishes a 25 percent investment tax credit for investments in semiconductor manufacturing, including the manufacturing of specialized equipment required for semiconductor manufacturing; authorizes funding for research and innovation programs; and appropriates $19.4 million in emergency supplemental funding to address security threats to the Supreme Court of the United States.
Thank you to Speaker Pelosi, Leader Schumer, Leader McConnell, Leader Hoyer, as well as Senators Cantwell, Wicker Young, Kelly, Warner, Cornyn and Representatives Eddie Bernice Johnson, Pallone, McCaul, and Matsui.
Joseph R. Biden, Press Release: Bills Signed: H.R. 4346 Online by Gerhard Peters and John T. Woolley, The American Presidency Project https://www.presidency.ucsb.edu/node/357224